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Technologies
- Basis Of Technology
- Electrical Connectors
- High Strength Metal
- SEM, FIB, AFM pictures of metal
- Scanning Electron Microscope pictures of PI
- Optical Microscope pictures of PI
- New Squeegee Blade Technology!
- Standard wiping contact spalling
- Momentum plating
- Heat Exchanger and Heat Pipe
- Mechanical Connectors
- Thermal Connectors
- Electrical Insulators
- Thermal Insulators
Products
- Socket Types:
- Test Sockets
- Burn-In Sockets
- Characterization Sockets
- RF Sockets
- Emulation Sockets
- Production Sockets
- Known Good Die (KGD) Sockets
- System In a Package (SIP) Sockets
- Field Replaceable Socket Examples
- Packaging Types:
- BGA
- Land Grid Arrays
- PLCC
- QFP
- TSOP
- CSP (Chip Scale Package)
- SIP (System In A Package)
- Lead Frames
- Tab Frames
- Known Good Die
- Stacked Die / Wafers
- J-Lead
- Gull Wing Lead
- Flip Chip
- RFID Tags
- PCB Test Fixture
- Removable Interconnect
Applications
- Electronic
- Reducing Cray form factor using PI
- Removable Die Multi Chip Module (test/burn-in/production)
- Stacked Die / Wafers
- Surface Mount Package Test Fixture
- Die/Wafer Probe Card
- Lead Frames
- PCB/Cable Connector
- PCB Test Fixtures
- PCB Drill Hole/Blind Via
- LCD/Cable Connector
- Hard Disk drive Head Assembly
- Push Button Contact
- Micro-Fuses (Resetable & Blown Once)
- Micro-Reed Relays
- Smart Card/Smart Label
- RFID Tags
- Built-In Resistors
- Electric
- Mechanical (Diffusion Welds)
- Aircraft Rivet Replacement
- Automotive Spot Weld
- Mechanical fasteners (temporary and permanent)
- Mechanical welding (room temperature, with pressure)
- Thermal Connectors
Publications
- Brochure
- Press Releases
- Patents
- TDR, S parameter, Eye Diagrams
- Test Results
- Comparing Socket Technologies
- Papers on PI
- MicroModules Systems Papers
- Legal
Company
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