Scanning Electron Microscope pictures of PI

Examination of particle uniformity

6-12 μ particles coated with Ni and Cu, and pressed onto Cu. SEM at 1090x magnification, 60 degree angle.

SEM's of contact surface

Tin-Lead solder over Nickel coated particles.

22x magnification with 88x zoom view.

PLCC - J-Lead

Magnification 75x.

Magnification 150x.

SEM of pad probed by Particle Interconnect rigid socket

• Surface of PLCC J-Lead after 30,000 insertions.
• Surface finish of lead passed steam aging test.