Field Replaceable Socket

  1. Particle Interconnect Package
  2. Field replaceable socket examples
  3. Removable die MCM

Particle Interconnect Package

Particle Interconnect Package (PIP)

Advanced low-cost minimal IC package.

QFP 132 lead, 0.012" pitch OLB (Outer Lead Bond). Leadframe / Chip-On-Board socket & carrier.
  • 0.001"-0.005" flex/rigid board with flip chip attached topside (heat up/electrical down) {3 μ line & space on 3 μ flex obtainable at special labs}
  • Board acts as probe card/burn-in socket/final package, only bad die are thrown away at assembly.
  • Leads completely supported yet flexible and damage resistant.
  • Outer Lead Bond (OLB) attachment by conventional heated solder reflow method or non-heated Particle Interconnect methods.
  • Automatic or manual placement even with finest pitches.
  • Controlled impedance routing from OLB to die pad in either single or multi-layer PCB.
  • Lower cost than etched/stamped leadframes or conventional flip chip techniques.

Particle Interconnect lead frame package

Solder bumped chip (ILB) on Particle Interconnect lead frame (OLB). Particle Interconnect bumped chip (ILB) on Particle Interconnect lead frame (OLB).

Testing bumped chip on Particle Interconnect leadframe

Field replaceable socket examples

Alternative Particle Interconnect lead frame with holddown

Removable single unit - proof of concept.

0.025" pitch, 196 lead, ceramic QFP. 0.020" pitch, 256 lead, ceramic QFP.

Field replaceable socket vs. nonfield replaceable packages

Field replaceable socket diagram.

Field replaceable socket

Conceptual drawing

Field replaceable socket contact resistance

Contact resistance vs current capacity

0.020" pitch connection. Accuracy:

Forcing current
Amps		 Sense voltage
milli-volts		 Resistance
(R = V / I)
milli-ohms
0.0001 too small to read -
0.0010 too small to read -
0.0100 0.0113 1.13
0.1000 0.1243 1.24
0.2000 0.2480 1.24
0.3000 0.3751 1.25
0.4000 0.5011 1.25
0.5000 0.6351 1.27
0.6000 0.7660 1.27
0.7000 0.9042 1.29
0.8000 1.0240 1.28
0.9000 1.1631 1.29
1.0000 1.2796 1.28
1.5000 1.8978 1.26
2.0000 2.5438 1.27

Removable die MCM

Particle Interconnect - Sandia Lab Known Good Die (KGD)

Known-Good-Die probe/burn-in. Proof of removable die MCM-L/D/C.

0 failures, 11 runs shown above. Particle Interconnect surface mount BGA socket.
Particle Interconnect - Sandia mBGA interposer schematic. Sandia mBGA interposer

Removable die Multichip Module - L/D/C

(a) Heat sink, (b) precisor, (c) bumped-die socket. (Dielectric web material not shown.)

Removable die MCM Louver contact