Emulation Socket
Theory
Testing bumped chip on Particle Interconnect leadframe
Field replacable socket
Alternative Particle Interconnect lead frame with holddown
Removable single unit - proof of concept.
0.025" pitch, 196 lead, ceramic QFP. | 0.020" pitch, 256 lead, ceramic QFP. |
Field replacable socket vs. nonfield replacable packages
Field replacable socket diagram. |
Field replacable socket
Conceptual drawing |
Field replacable socket contact resistance
Contact resistance vs current capacity
0.020" pitch connection. Accuracy:
- Current source: ± 0.1 milli-A, 5 digit resolution.
- Digital voltmeter: ± microV, 6 digit resolution.
Forcing current Amps |
Sense voltage milli-volts |
Resistance (R = V / I) milli-ohms |
0.0001 | too small to read | - |
0.0010 | too small to read | - |
0.0100 | 0.0113 | 1.13 |
0.1000 | 0.1243 | 1.24 |
0.2000 | 0.2480 | 1.24 |
0.3000 | 0.3751 | 1.25 |
0.4000 | 0.5011 | 1.25 |
0.5000 | 0.6351 | 1.27 |
0.6000 | 0.7660 | 1.27 |
0.7000 | 0.9042 | 1.29 |
0.8000 | 1.0240 | 1.28 |
0.9000 | 1.1631 | 1.29 |
1.0000 | 1.2796 | 1.28 |
1.5000 | 1.8978 | 1.26 |
2.0000 | 2.5438 | 1.27 |
Particle Interconnect Package (PIP)
Advanced low-cost minimal IC package.
QFP 132 lead, 0.012" pitch OLB (Outer Lead Bond). | Leadframe / Chip-On-Board socket & carrier. |
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Successful emulation project
BGA package soldered to BGA socket and pinned on the outside edge for CTI (Connector Technology Inc.) in 1992.
Particle Interconnect through-hole BGA socket
0.050" pitch, 15x15 version.